70T3509MS133BPGI
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 3-STATE (Memory Format) Memory 85C 2.6V 36Mb 1.37A
PDF
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Buying Options
Total Price: USD $608.28
Unit Price: USD $608.28405
≥1 USD $608.28405
Inventory: 15
Minimum: 1
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Technical Details
Compliance
Lead Free Lead Free
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 1.76mm
Width 17mm
Length 17mm
Height Seated (Max) 1.7mm
Technical
Word Size 36b
Sync/Async Synchronous
I/O Type COMMON
Standby Current-Max 0.08A
Density 36 Mb
Address Bus Width 40b
Output Characteristics 3-STATE
Organization 1MX36
Access Time 4.2 ns
Frequency (Max) 133MHz
Memory Type RAM, SDR, SRAM
Nominal Supply Current 1.37A
Number of Ports 2
Memory Size 4.5MB
Min Supply Voltage 2.4V
Max Supply Voltage 2.6V
Interface Parallel
Temperature Grade INDUSTRIAL
Operating Supply Voltage 2.5V
Pin Count 256
Time@Peak Reflow Temperature-Max (s) 30
Frequency 133MHz
Terminal Pitch 1mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Published 2009
Packaging Bulk
Physical
Number of Pins 256
Package / Case BGA
Mount Surface Mount
Supply Chain
Factory Lead Time 14 Weeks
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