70T3509MS133BPG
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 3-STATE (Memory Format) Memory 70C 2.6V 36Mb 1.12A
PDF
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Buying Options
Total Price: USD $411.54
Unit Price: USD $411.5408
≥1 USD $411.5408
Inventory: 58
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 14 Weeks
Physical
Mount Surface Mount
Package / Case BGA
Number of Pins 256
Technical
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 2.6V
Min Supply Voltage 2.4V
Memory Size 4.5MB
Number of Ports 2
Nominal Supply Current 1.12A
Memory Type RAM, SDR, SRAM
Max Supply Current 1.12A
Frequency (Max) 133MHz
Access Time 4.2 ns
Organization 1MX36
Output Characteristics 3-STATE
Address Bus Width 40b
Density 36 Mb
Standby Current-Max 0.06A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Dimensions
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
Thickness 1.76mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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