70T3319S166BFG
RoHS
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Package /
Category Integrated Circuits (ICs) / Memory
Description
Active BALL 3-STATE 2010 (Memory Format) Memory 70C 2.5V 4Mb 0.015A
PDF
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Buying Options
Total Price: USD $530.92
Unit Price: USD $530.919692
≥1 USD $530.919692
≥203 USD $211.840354
≥497 USD $204.761197
≥1001 USD $201.263631
Inventory: 1146
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Surface Mount YES
Number of Pins 208
Technical
Published 2010
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 208
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 0.8mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 208
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Number of Ports 2
Memory Type RAM, SRAM
Supply Current-Max 0.45mA
Output Characteristics 3-STATE
Address Bus Width 18b
Density 4 Mb
Standby Current-Max 0.015A
Access Time (Max) 3.6 ns
I/O Type COMMON
Dimensions
Height Seated (Max) 1.7mm
Length 15mm
Width 15mm
Thickness 1.4mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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