70P265L65BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Discontinued BALL 3-STATE 2011 (Memory Format) Memory 85C 3V 256kb 0.000008A
PDF
/
Inventory: 3836
Minimum: /
The more specific your information, the faster response you will get.
Please complete the following form with the details of your request part and
contact information to get a quote.
Quotation Consultation
Technical Details
Compliance
Lead Free Lead Free
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 1mm
Width 6mm
Length 6mm
Technical
I/O Type COMMON
Standby Current-Max 0.000008A
Density 256 kb
Address Bus Width 28b
Output Characteristics 3-STATE
Organization 16KX16
Access Time 65 ns
Supply Current-Max 0.07mA
Memory Type RAM, SDR, SRAM
Number of Ports 2
Memory Size 32kB
Min Supply Voltage 1.8V
Max Supply Voltage 3V
Interface Parallel
Temperature Grade INDUSTRIAL
Pin Count 100
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.5mm
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code EAR99
Number of Terminations 100
Moisture Sensitivity Level (MSL) 3
Part Status Discontinued
Pbfree Code yes
JESD-609 Code e1
Published 2011
Packaging Bulk
Physical
Number of Pins 100
Surface Mount YES
Package / Case TFBGA
Recommended For You
70P265L65BYGI+price,70P265L65BYGI+datasheet,70P265L65BYGI+in stock,buy+70P265L65BYGI,finder+70P265L65BYGI,70P265L65BYGI+tutorials,70P265L65BYGI+download