70P264L55BYGI8
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 3-STATE 2009 Parallel (Memory Format) Memory 85C 1.9V 256kb 0.000006A
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Technical Details
Physical
Package / Case TFBGA
Surface Mount YES
Number of Pins 81
Technical
Packaging Tape & Reel
Published 2009
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 81
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 81
Operating Supply Voltage 1.8V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 1.9V
Min Supply Voltage 1.7V
Memory Size 32kB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Access Time 55 ns
Organization 16KX16
Output Characteristics 3-STATE
Memory Width 16
Address Bus Width 28b
Density 256 kb
Standby Current-Max 0.000006A
I/O Type COMMON
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
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