Welcome to flywing-tech.com
Fly-Wing electronic components distributor Online Store
English
Favorite
Favorite
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description BALL 3-STATE 2009 Parallel (Memory Format) Memory 85C 1.9V 256kb 0.000006A
PDF
/
Inventory: 8255
Minimum: /
The more specific your information, the faster response you will get.
Please complete the following form with the details of your request part and contact information to get a quote.
Quotation Consultation
Is there anything else we can help you solve?
Inquiry

Technical Details

Physical

Package / Case TFBGA
Surface Mount YES
Number of Pins 81

Technical

Packaging Tape & Reel
Published 2009
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 81
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 81
Operating Supply Voltage 1.8V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 1.9V
Min Supply Voltage 1.7V
Memory Size 32kB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Access Time 55 ns
Organization 16KX16
Output Characteristics 3-STATE
Memory Width 16
Address Bus Width 28b
Density 256 kb
Standby Current-Max 0.000006A
I/O Type COMMON

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

70P264L55BYGI8+price,70P264L55BYGI8+datasheet,70P264L55BYGI8+in stock,buy+70P264L55BYGI8,finder+70P264L55BYGI8,70P264L55BYGI8+tutorials,70P264L55BYGI8+download