70P259L90BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Discontinued BALL 3-STATE 2008 (Memory Format) Memory 85C 3V 128kb 0.006A
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Inventory: 2843
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Technical Details
Compliance
Lead Free Lead Free
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 1mm
Width 6mm
Length 6mm
Technical
I/O Type COMMON
Standby Current-Max 0.006A
Density 128 kb
Address Bus Width 26b
Output Characteristics 3-STATE
Organization 8KX16
Access Time 90 ns
Supply Current-Max 0.06mA
Memory Type RAM, SDR, SRAM
Number of Ports 2
Memory Size 16kB
Min Supply Voltage 1.8V
Max Supply Voltage 3V
Interface Parallel
Temperature Grade INDUSTRIAL
Pin Count 100
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.5mm
Supply Voltage 2.6V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code EAR99
Number of Terminations 100
Moisture Sensitivity Level (MSL) 3
Part Status Discontinued
Pbfree Code yes
JESD-609 Code e1
Published 2008
Packaging Bulk
Physical
Number of Pins 100
Surface Mount YES
Package / Case TFBGA
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