70P259L65BYGI8
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2008 Parallel BOTTOM (Memory Format) Memory 85C 3V 128kb 65ns
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Technical Details
Compliance
RoHS Status RoHS Compliant
Radiation Hardening No
Technical
Density 128 kb
Address Bus Width 26b
Memory Width 16
Organization 8KX16
Access Time 65 ns
Memory Type RAM, SDR, SRAM
Number of Ports 2
Memory Size 16kB
Min Supply Voltage 1.8V
Max Supply Voltage 3V
Interface Parallel
Temperature Grade INDUSTRIAL
Pin Count 100
Time@Peak Reflow Temperature-Max (s) 30
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish TIN SILVER COPPER
ECCN Code EAR99
Number of Terminations 100
Moisture Sensitivity Level (MSL) 3
Pbfree Code yes
JESD-609 Code e1
Published 2008
Packaging Tape & Reel
Physical
Number of Pins 100
Surface Mount YES
Package / Case TFBGA
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