70P259L65BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Discontinued BALL 3-STATE 2008 (Memory Format) Memory 85C 3V 128kb 0.006A
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Inventory: 3085
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Technical Details
Technical
Memory Type RAM, SDR, SRAM
Supply Current-Max 0.07mA
Access Time 65 ns
Organization 8KX16
Output Characteristics 3-STATE
Address Bus Width 26b
Density 128 kb
Standby Current-Max 0.006A
I/O Type COMMON
Number of Ports 2
Memory Size 16kB
Min Supply Voltage 1.8V
Max Supply Voltage 3V
Interface Parallel
Temperature Grade INDUSTRIAL
Pin Count 100
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.5mm
Supply Voltage 2.6V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code EAR99
Number of Terminations 100
Moisture Sensitivity Level (MSL) 3
Part Status Discontinued
Pbfree Code yes
JESD-609 Code e1
Published 2008
Packaging Bulk
Dimensions
Length 6mm
Width 6mm
Thickness 1mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Physical
Number of Pins 100
Surface Mount YES
Package / Case TFBGA
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