70P254L55BYGI8
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2009 Parallel BOTTOM (Memory Format) Memory 85C 1.9V 128kb 55ns
PDF
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Buying Options
Total Price: USD $42.96
Unit Price: USD $42.9571
≥1 USD $42.9571
≥10 USD $35.2469
≥100 USD $34.1449
≥500 USD $33.04385
≥1000 USD $31.9428
Inventory: 503
Minimum: 1
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Technical Details
Compliance
RoHS Status RoHS Compliant
Radiation Hardening No
Technical
Density 128 kb
Address Bus Width 26b
Memory Width 16
Organization 8KX16
Access Time 55 ns
Memory Type RAM, SRAM
Number of Ports 2
Memory Size 16kB
Min Supply Voltage 1.7V
Max Supply Voltage 1.9V
Interface Parallel
Temperature Grade INDUSTRIAL
Operating Supply Voltage 1.8V
Pin Count 81
Time@Peak Reflow Temperature-Max (s) 30
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish TIN SILVER COPPER
ECCN Code EAR99
Number of Terminations 81
Moisture Sensitivity Level (MSL) 3
Pbfree Code yes
JESD-609 Code e1
Published 2009
Packaging Tape & Reel
Physical
Number of Pins 81
Surface Mount YES
Package / Case TFBGA
Supply Chain
Factory Lead Time 16 Weeks
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