70P254L55BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Active BALL 3-STATE 2009 (Memory Format) Memory 85C 1.9V 128kb 0.000006A
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Inventory: 4349
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Technical Details
Compliance
Lead Free Lead Free
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 1mm
Width 5mm
Length 5mm
Technical
I/O Type COMMON
Standby Current-Max 0.000006A
Density 128 kb
Address Bus Width 26b
Output Characteristics 3-STATE
Organization 8KX16
Access Time 55 ns
Memory Type RAM, SDR, SRAM
Number of Ports 2
Memory Size 16kB
Min Supply Voltage 1.7V
Max Supply Voltage 1.9V
Interface Parallel
Temperature Grade INDUSTRIAL
Operating Supply Voltage 1.8V
Pin Count 81
Time@Peak Reflow Temperature-Max (s) 30
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish TIN SILVER COPPER
ECCN Code EAR99
Number of Terminations 81
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Published 2009
Packaging Bulk
Physical
Number of Pins 81
Surface Mount YES
Package / Case TFBGA
Supply Chain
Factory Lead Time 16 Weeks
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