70P249L90BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Discontinued BALL 3-STATE 2008 (Memory Format) Memory 85C 3V 64kb 0.06mA
PDF
/
Inventory: 4754
Minimum: /
The more specific your information, the faster response you will get.
Please complete the following form with the details of your request part and
contact information to get a quote.
Quotation Consultation
Technical Details
Physical
Package / Case TFBGA
Surface Mount YES
Number of Pins 100
Technical
Packaging Bulk
Published 2008
JESD-609 Code e1
Pbfree Code yes
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 100
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.6V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 100
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3V
Min Supply Voltage 1.8V
Memory Size 8kB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Supply Current-Max 0.06mA
Access Time 90 ns
Organization 4KX16
Output Characteristics 3-STATE
Address Bus Width 24b
Density 64 kb
Standby Current-Max 0.000006A
I/O Type COMMON
Dimensions
Length 6mm
Width 6mm
Thickness 1mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Recommended For You
70P249L90BYGI+price,70P249L90BYGI+datasheet,70P249L90BYGI+in stock,buy+70P249L90BYGI,finder+70P249L90BYGI,70P249L90BYGI+tutorials,70P249L90BYGI+download