70P245L65BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Discontinued BALL 3-STATE 2011 (Memory Format) Memory 85C 3V 64kb 0.000008A
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Inventory: 5324
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Technical Details
Physical
Package / Case TFBGA
Surface Mount YES
Number of Pins 100
Technical
Packaging Bulk
Published 2011
JESD-609 Code e1
Pbfree Code yes
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 100
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 100
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3V
Min Supply Voltage 1.8V
Memory Size 8kB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Supply Current-Max 0.07mA
Access Time 65 ns
Organization 4KX16
Output Characteristics 3-STATE
Address Bus Width 24b
Density 64 kb
Standby Current-Max 0.000008A
I/O Type COMMON
Dimensions
Length 6mm
Width 6mm
Thickness 1mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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