70P244L55BYGI
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
Discontinued BALL 3-STATE 2009 (Memory Format) Memory 85C 1.9V 64kb 0.000006A
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Inventory: 1359
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Technical Details
Physical
Package / Case TFBGA
Surface Mount YES
Number of Pins 81
Technical
Packaging Bulk
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 81
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 81
Operating Supply Voltage 1.8V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 1.9V
Min Supply Voltage 1.7V
Memory Size 8kB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Access Time 55 ns
Organization 4KX16
Output Characteristics 3-STATE
Address Bus Width 24b
Density 64 kb
Standby Current-Max 0.000006A
I/O Type COMMON
Dimensions
Length 5mm
Width 5mm
Thickness 1mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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