7025L25J8
RoHS
/
Package PLCC
Category Integrated Circuits (ICs) / Memory
Description
Asynchronous Active Lead Tin J BEND (Memory Format) Memory 70C 5.5V 128kb 220mA
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 84
Technical
Published 2008
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 84
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 84
Qualification Status Not Qualified
Operating Supply Voltage 5V
Power Supplies 5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Memory Size 16kB
Number of Ports 2
Nominal Supply Current 220mA
Memory Type RAM, SDR, SRAM
Access Time 25 ns
Organization 8KX16
Output Characteristics 3-STATE
Address Bus Width 13b
Density 128 kb
Standby Current-Max 0.0015A
I/O Type COMMON
Sync/Async Asynchronous
Word Size 16b
Standby Voltage-Min 2V
Dimensions
Height Seated (Max) 4.57mm
Length 29.21mm
Width 29.21mm
Thickness 3.63mm
Compliance
RoHS Status RoHS Compliant
Lead Free Contains Lead
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