XCF128XFT64C
RoHS
/
Package 64-TBGA
Category Integrated Circuits (ICs) / Memory - Configuration Proms for FPGAs
Description
XCF128X Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 10mm 0.000075A 128Mb 85ns
PDF
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Buying Options
Total Price: USD $77.1
Unit Price: USD $77.102
≥1 USD $77.102
≥10 USD $74.6928
≥100 USD $72.28265
≥500 USD $69.87345
≥1000 USD $62.6449
Inventory: 2102
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Lead, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-TBGA
Number of Pins 64
Technical
Operating Temperature -40°C~85°C
Packaging Tray
Published 2007
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Flash Memories
Technology CMOS
Voltage - Supply 1.7V~2V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCF128X
Pin Count 64
Supply Voltage-Max (Vsup) 2V
Power Supplies 1.81.8/3.3V
Supply Voltage-Min (Vsup) 1.7V
Programmable Type In System Programmable
Memory Size 128Mb
Supply Current-Max 0.053mA
Organization 8MX16
Memory Width 16
Standby Current-Max 0.000075A
Memory Density 134217728 bit
Access Time (Max) 85 ns
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 1.8V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4127
Page Size 4words
Ready/Busy YES
Common Flash Interface YES
Dimensions
Height Seated (Max) 1.2mm
Length 13mm
Width 10mm
Compliance
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Alternative Model
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