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Package TFBGA
Category Integrated Circuits (ICs) / Logic - Specialty Logic
Description IC REGIST BUFF 25BIT DDR2 176BGA
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Technical Details

Physical

Mount Surface Mount
Package / Case TFBGA
Number of Pins 176

Technical

Packaging Tape & Reel (TR)
Published 2006
JESD-609 Code e1
Pbfree Code yes
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 176
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Subcategory Other Logic ICs
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.65mm
Frequency 410MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 176
Number of Outputs 56
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Number of Elements 1
Polarity Non-Inverting
Temperature Grade COMMERCIAL
Max Supply Voltage 1.9V
Min Supply Voltage 1.7V
Number of Bits 28
Propagation Delay 3 ns
Frequency (Max) 410MHz
Logic Function Buffer
Output Characteristics OPEN-DRAIN
Logic IC Type D FLIP-FLOP
High Level Output Current -6mA
Low Level Output Current 6mA
Clock Edge Trigger Type Positive Edge

Dimensions

Length 15mm
Width 6mm
Thickness 1.2mm

Compliance

RoHS Status RoHS Compliant
Lead Free Lead Free

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