SN74LVC2G74YEPR
RoHS
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Package 8-XFBGA, DSBGA
Category Integrated Circuits (ICs) / Logic - Flip Flops
Description
Tape & Reel (TR) e0 74LVC TIN LEAD flip flop 0.5mm 5.4ns @ 5V 50pF 140MHz 1.65V~5.5V
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Technical Details
Physical
Mounting Type Surface Mount
Package / Case 8-XFBGA, DSBGA
Surface Mount YES
Technical
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series 74LVC
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8
Type D-Type
Terminal Finish TIN LEAD
Technology CMOS
Voltage - Supply 1.65V~5.5V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XBGA-B8
Function Set(Preset) and Reset
Qualification Status COMMERCIAL
Output Type Differential
Number of Elements 1
Supply Voltage-Max (Vsup) 5.5V
Number of Bits 1
Clock Frequency 140MHz
Family LVC/LCX/Z
Current - Quiescent (Iq) 10μA
Output Characteristics 3-STATE
Current - Output High, Low 32mA 32mA
Output Polarity COMPLEMENTARY
Max Propagation Delay @ V, Max CL 5.4ns @ 5V, 50pF
Trigger Type Positive Edge
Input Capacitance 5pF
fmax-Min 200 MHz
Dimensions
Height Seated (Max) 0.5mm
Width 0.9mm
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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