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RoHS
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Package 8-XFBGA, DSBGA
Category Integrated Circuits (ICs) / Logic - Flip Flops
Description Tape & Reel (TR) e0 74AUC TIN LEAD flip flop 0.5mm 0.8V 1.8ns @ 2.5V 30pF 275MHz
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Width 0.9mm
Height Seated (Max) 0.5mm

Technical

Propagation Delay (tpd) 3.9 ns
Input Capacitance 2.5pF
Trigger Type Positive Edge
Max Propagation Delay @ V, Max CL 1.8ns @ 2.5V, 30pF
Number of Bits per Element 1
Output Polarity TRUE
Current - Output High, Low 9mA 9mA
Current - Quiescent (Iq) 10μA
Family AUC
Clock Frequency 275MHz
Supply Voltage-Min (Vsup) 0.8V
Number of Elements 2
Output Type Non-Inverted
Qualification Status COMMERCIAL
Function Standard
JESD-30 Code R-XBGA-B8
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Terminal Pitch 0.5mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 0.8V~2.7V
Technology CMOS
Terminal Finish TIN LEAD
Type D-Type
Number of Terminations 8
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
Pbfree Code yes
JESD-609 Code e0
Series 74AUC
Packaging Tape & Reel (TR)
Operating Temperature -40°C~85°C TA

Physical

Surface Mount YES
Package / Case 8-XFBGA, DSBGA
Mounting Type Surface Mount

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