SN74AUC1G80YEPR
RoHS
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Package 5-XFBGA, DSBGA
Category Integrated Circuits (ICs) / Logic - Flip Flops
Description
Tape & Reel (TR) e0 74AUC TIN LEAD flip flop 0.5mm 0.8V 1.8ns @ 2.5V 30pF 275MHz
PDF
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Buying Options
Total Price: USD $0.22
Unit Price: USD $0.22
≥1 USD $0.22
Inventory: 17603
Minimum: 1
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Technical Details
Physical
Mounting Type Surface Mount
Package / Case 5-XFBGA, DSBGA
Surface Mount YES
Technical
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series 74AUC
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 5
Type D-Type
Terminal Finish TIN LEAD
Technology CMOS
Voltage - Supply 0.8V~2.7V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XBGA-B5
Function Standard
Qualification Status COMMERCIAL
Output Type Inverted
Number of Elements 1
Supply Voltage-Max (Vsup) 2.7V
Supply Voltage-Min (Vsup) 0.8V
Number of Bits 1
Clock Frequency 275MHz
Family AUC
Current - Quiescent (Iq) 10μA
Output Characteristics 3-STATE
Current - Output High, Low 9mA 9mA
Max Propagation Delay @ V, Max CL 1.8ns @ 2.5V, 30pF
Trigger Type Positive Edge
Input Capacitance 2.5pF
Propagation Delay (tpd) 3.9 ns
fmax-Min 275 MHz
Dimensions
Height Seated (Max) 0.5mm
Width 0.9mm
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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