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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description BOTTOM COMMERCIAL PARALLEL BALL (Function) FIFO 0C 3.45V 1179648bit 15ns
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Technical Details

Compliance

RoHS Status RoHS Compliant

Dimensions

Width 17mm
Length 17mm
Height Seated (Max) 3.5mm

Technical

Output Enable YES
Memory IC Type OTHER FIFO
Parallel/Serial PARALLEL
Memory Density 1179648 bit
Standby Current-Max 0.015A
Memory Width 72
Organization 16KX72
Access Time 15 ns
Supply Current-Max 0.075mA
Clock Frequency 66.7MHz
Operating Mode SYNCHRONOUS
Supply Voltage-Min (Vsup) 3.15V
Temperature Grade COMMERCIAL
Power Supplies 3.3V
Supply Voltage-Max (Vsup) 3.45V
Qualification Status Not Qualified
Pin Count 256
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory FIFOs
HTS Code 8542.32.00.71
Additional Feature RETRANSMIT
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code EAR99
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0
Published 2005

Physical

Number of Pins 256
Package / Case BGA
Mount Surface Mount

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