IDT72T54262L6-7BBI
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
BOTTOM INDUSTRIAL PARALLEL BALL (Function) FIFO -40C 2.625V 2621440bit 6.7ns
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Technical Details
Physical
Mount Surface Mount
Package / Case BGA
Technical
Published 2009
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 324
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature CAN ALSO BE CONFIGURED AS 131,072 X 10 X 4
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 2.5V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.375V
Operating Mode SYNCHRONOUS
Clock Frequency 150MHz
Supply Current-Max 0.35mA
Access Time 3.8 ns
Organization 128KX20
Memory Width 20
Standby Current-Max 0.015A
Memory Density 2621440 bit
Parallel/Serial PARALLEL
Memory IC Type OTHER FIFO
Alternate Memory Width 10
Output Enable YES
Cycle Time 6.7 ns
Dimensions
Height Seated (Max) 1.97mm
Length 19mm
Width 19mm
Compliance
RoHS Status Non-RoHS Compliant
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