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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description BOTTOM COMMERCIAL PARALLEL BALL (Function) FIFO 0C 2.625V 2621440bit 5ns
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Width 19mm
Length 19mm
Height Seated (Max) 1.97mm

Technical

Output Enable YES
Alternate Memory Width 10
Memory IC Type OTHER FIFO
Parallel/Serial PARALLEL
Memory Density 2621440 bit
Standby Current-Max 0.015A
Memory Width 20
Organization 128KX20
Access Time 5 ns
Supply Current-Max 0.35mA
Clock Frequency 200MHz
Operating Mode SYNCHRONOUS
Supply Voltage-Min (Vsup) 2.375V
Temperature Grade COMMERCIAL
Power Supplies 2.5V
Supply Voltage-Max (Vsup) 2.625V
Qualification Status Not Qualified
Pin Count 324
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code not_compliant
Terminal Pitch 1mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory FIFOs
HTS Code 8542.32.00.71
Additional Feature CAN ALSO BE CONFIGURED AS 131,072 X 10 X 4
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code EAR99
Number of Terminations 324
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0
Published 2009

Physical

Package / Case BGA
Mount Surface Mount

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