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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description BOTTOM INDUSTRIAL PARALLEL BALL (Function) FIFO -40C 2.625V 2621440bit 6.7ns
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Technical Details

Physical

Mount Surface Mount
Package / Case BGA

Technical

Published 2009
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 324
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/2.52.5V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.375V
Operating Mode SYNCHRONOUS
Clock Frequency 150MHz
Access Time 3.8 ns
Organization 64KX40
Memory Width 40
Memory Density 2621440 bit
Parallel/Serial PARALLEL
Memory IC Type OTHER FIFO
Output Enable YES
Cycle Time 6.7 ns

Dimensions

Height Seated (Max) 1.97mm
Length 19mm
Width 19mm

Compliance

RoHS Status Non-RoHS Compliant

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