IDT72T40118L4BBG
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
BOTTOM COMMERCIAL PARALLEL BALL (Function) FIFO 0C 2.625V 5242880bit 4ns
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Technical Details
Technical
Additional Feature ALTERNATIVE MEMORY WIDTH: 10 AND 20
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position BOTTOM
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish TIN SILVER COPPER
ECCN Code EAR99
Number of Terminations 208
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e1
Published 2009
Output Enable YES
Parallel/Serial PARALLEL
Memory Density 5242880 bit
Memory Width 40
Organization 128KX40
Access Time 4 ns
Operating Mode SYNCHRONOUS
Supply Voltage-Min (Vsup) 2.375V
Temperature Grade COMMERCIAL
Supply Voltage-Max (Vsup) 2.625V
Qualification Status Not Qualified
Pin Count 208
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Physical
Package / Case BGA
Mount Surface Mount
Compliance
RoHS Status RoHS Compliant
Dimensions
Width 17mm
Length 17mm
Height Seated (Max) 1.97mm
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