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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description BOTTOM COMMERCIAL Synchronous PARALLEL (Function) FIFO 0C 2.625V 2.5Mb 5ns
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Technical Details

Physical

Mount Surface Mount
Package / Case BGA
Number of Pins 208

Technical

Published 2009
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 208
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature ALTERNATIVE MEMORY WIDTH: 10 AND 20
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 208
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Element Configuration Dual
Nominal Supply Current 60mA
Access Time 5 ns
Direction Unidirectional
Organization 64KX40
Memory Width 40
Density 2.5 Mb
Standby Current-Max 0.05A
Parallel/Serial PARALLEL
Sync/Async Synchronous
Word Size 40b
Memory IC Type OTHER FIFO
Output Enable YES

Dimensions

Height Seated (Max) 1.97mm
Length 17mm
Width 17mm

Compliance

RoHS Status RoHS Compliant

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