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Package TSSOP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description COMMERCIAL Asynchronous PARALLEL Tin (Function) FIFO 0C 3.6V 72kb 25ns
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Contact Plating Tin
Mount Surface Mount
Package / Case TSSOP
Number of Pins 56

Technical

Published 1997
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 56
ECCN Code EAR99
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 56
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 100mA
Max Supply Current 100mA
Clock Frequency 40MHz
Access Time 15 ns
Direction Bidirectional
Organization 4KX9
Density 72 kb
Standby Current-Max 0.005A
Parallel/Serial PARALLEL
Sync/Async Asynchronous
Word Size 9b
Memory IC Type OTHER FIFO
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Output Enable NO
Cycle Time 25 ns

Dimensions

Height Seated (Max) 1.2mm
Length 14mm
Width 6.1mm
Thickness 1mm

Compliance

RoHS Status RoHS Compliant
Lead Free Lead Free

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