72V82L20PA
RoHS
/
Package TSSOP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
COMMERCIAL Asynchronous PARALLEL Lead Tin (Function) FIFO 0C 3.3V 18kb 30ns
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TSSOP
Number of Pins 56
Technical
Published 2009
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 1
Number of Terminations 56
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 56
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 100mA
Max Supply Current 100mA
Clock Frequency 33MHz
Access Time 20 ns
Direction Bidirectional
Organization 1KX9
Density 18 kb
Parallel/Serial PARALLEL
Sync/Async Asynchronous
Word Size 9b
Memory IC Type OTHER FIFO
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Output Enable YES
Cycle Time 30 ns
Dimensions
Height Seated (Max) 1.2mm
Length 14mm
Width 6.1mm
Thickness 1mm
Compliance
RoHS Status RoHS Compliant
Lead Free Contains Lead
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