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Package TSSOP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description COMMERCIAL Asynchronous PARALLEL Lead Tin (Function) FIFO 0C 3.6V 2.3kB 15ns
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status RoHS Compliant

Dimensions

Thickness 1mm
Width 6.1mm
Length 14mm

Technical

Output Enable YES
FWFT Support No
Retransmit Capability Yes
Bus Directional Bidirectional
Memory IC Type OTHER FIFO
Word Size 9b
Sync/Async Asynchronous
Parallel/Serial PARALLEL
Density 18 kb
Organization 1KX9
Data Bus Width 9b
Access Time 15 ns
Clock Frequency 40MHz
Max Supply Current 100mA
Nominal Supply Current 100mA
Element Configuration Dual
Memory Size 2.3kB
Min Supply Voltage 3V
Max Supply Voltage 3.6V
Number of Circuits 2
Temperature Grade COMMERCIAL
Operating Supply Voltage 3.3V
Pin Count 56
Time@Peak Reflow Temperature-Max (s) 20
Terminal Pitch 0.5mm
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) 240
Terminal Form GULL WING
Technology CMOS
Subcategory FIFOs
Additional Feature RETRANSMIT
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Lead (Sn85Pb15)
ECCN Code EAR99
Number of Terminations 56
Moisture Sensitivity Level (MSL) 1
Part Status Active
Pbfree Code no
JESD-609 Code e0
Published 2005

Physical

Number of Pins 56
Package / Case TSSOP
Mount Surface Mount
Contact Plating Lead, Tin

Supply Chain

Factory Lead Time 7 Weeks

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