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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description BOTTOM COMMERCIAL PARALLEL Copper Silver Tin (Function) FIFO 0C 2.625V 2359296bit 4.44ns
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Buying Options
Total Price: USD $572.81
Unit Price: USD $572.80908
≥1 USD $572.80908
≥200 USD $228.554884
≥500 USD $220.917744
≥1000 USD $217.143157
Inventory: 1206
Minimum: 1
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Technical Details

Compliance

Lead Free Lead Free
RoHS Status RoHS Compliant

Dimensions

Thickness 1.76mm
Width 19mm
Length 19mm
Height Seated (Max) 1.97mm

Technical

Cycle Time 4.44 ns
Output Enable YES
Retransmit Capability Yes
Bus Directional Unidirectional
Memory IC Type OTHER FIFO
Parallel/Serial PARALLEL
Memory Density 2359296 bit
Standby Current-Max 0.02A
Organization 32KX72
Access Time 3.4 ns
Frequency (Max) 225MHz
Max Supply Current 130mA
Operating Mode SYNCHRONOUS
Element Configuration Dual
Min Supply Voltage 2.375V
Max Supply Voltage 2.625V
Temperature Grade COMMERCIAL
Operating Supply Voltage 2.5V
Qualification Status Not Qualified
Pin Count 324
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory FIFOs
HTS Code 8542.32.00.71
Additional Feature ASYNCHRONOUS OPERATION ALSO POSSIBLE
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code EAR99
Number of Terminations 324
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Published 2009

Physical

Number of Pins 324
Package / Case BGA
Mount Surface Mount
Contact Plating Copper, Silver, Tin

Supply Chain

Factory Lead Time 7 Weeks

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