72T3665L5BB
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
BOTTOM COMMERCIAL Asynchronous PARALLEL (Function) FIFO 0C 2.625V 144kb 5ns
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Technical Details
Physical
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 208
Weight 830.300833mg
Technical
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 208
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 208
Qualification Status Not Qualified
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Element Configuration Dual
Nominal Supply Current 70mA
Max Supply Current 70mA
Frequency (Max) 200MHz
Access Time 3.6 ns
Organization 4KX36
Density 144 kb
Standby Current-Max 0.01A
Parallel/Serial PARALLEL
Sync/Async Asynchronous
Word Size 36b
Memory IC Type OTHER FIFO
Bus Directional Unidirectional
Retransmit Capability Yes
Output Enable YES
Cycle Time 5 ns
Dimensions
Height Seated (Max) 1.97mm
Length 17mm
Width 17mm
Thickness 1.76mm
Compliance
RoHS Status RoHS Compliant
Lead Free Contains Lead
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