72T3665L4-4BBG
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
BOTTOM COMMERCIAL PARALLEL Copper Silver Tin (Function) FIFO 0C 2.625V 147456bit 4.4ns
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Technical Details
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case BGA
Weight 830.300833mg
Number of Pins 208
Compliance
Lead Free Lead Free
RoHS Status RoHS Compliant
Dimensions
Thickness 1.76mm
Width 17mm
Length 17mm
Height Seated (Max) 1.97mm
Technical
Cycle Time 4.4 ns
Output Enable YES
Retransmit Capability Yes
Bus Directional Unidirectional
Memory IC Type OTHER FIFO
Parallel/Serial PARALLEL
Memory Density 147456 bit
Standby Current-Max 0.01A
Organization 4KX36
Access Time 3.4 ns
Frequency (Max) 225MHz
Max Supply Current 70mA
Operating Mode SYNCHRONOUS
Element Configuration Dual
Min Supply Voltage 2.375V
Max Supply Voltage 2.625V
Temperature Grade COMMERCIAL
Operating Supply Voltage 2.5V
Qualification Status Not Qualified
Pin Count 208
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory FIFOs
HTS Code 8542.32.00.71
Additional Feature ASYNCHRONOUS OPERATION ALSO POSSIBLE
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish TIN SILVER COPPER
ECCN Code EAR99
Number of Terminations 208
Moisture Sensitivity Level (MSL) 3
Part Status Discontinued
Pbfree Code yes
JESD-609 Code e1
Published 2009
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