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Package BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description BOTTOM COMMERCIAL Asynchronous PARALLEL (Function) FIFO 0C 2.625V 2.3Mb 10ns
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status RoHS Compliant

Dimensions

Thickness 1.76mm
Width 19mm
Length 19mm
Height Seated (Max) 1.97mm

Technical

Cycle Time 10 ns
Output Enable YES
Retransmit Capability Yes
Bus Directional Unidirectional
Memory IC Type OTHER FIFO
Sync/Async Asynchronous
Parallel/Serial PARALLEL
Standby Current-Max 0.02A
Density 2.3 Mb
Organization 128KX18
Access Time 4.5 ns
Frequency (Max) 100MHz
Clock Frequency 50MHz
Max Supply Current 70mA
Nominal Supply Current 70mA
Element Configuration Dual
Min Supply Voltage 2.375V
Max Supply Voltage 2.625V
Temperature Grade COMMERCIAL
Operating Supply Voltage 2.5V
Qualification Status Not Qualified
Pin Count 240
Time@Peak Reflow Temperature-Max (s) 20
Terminal Pitch 1mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory FIFOs
HTS Code 8542.32.00.71
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code EAR99
Number of Terminations 240
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code no
JESD-609 Code e0
Published 2009

Physical

Number of Pins 240
Package / Case BGA
Mount Surface Mount
Contact Plating Lead, Tin

Supply Chain

Factory Lead Time 7 Weeks

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