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Package TSSOP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description COMMERCIAL Asynchronous PARALLEL Lead Tin (Function) FIFO 0C 5.5V 9kB 30ns
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TSSOP
Number of Pins 56

Technical

Published 2012
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 56
ECCN Code EAR99
Terminal Finish MATTE TIN
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 2
Supply Voltage 5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 56
Operating Supply Voltage 5V
Temperature Grade COMMERCIAL
Number of Circuits 2
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Memory Size 9kB
Element Configuration Dual
Nominal Supply Current 150mA
Max Supply Current 150mA
Access Time 20 ns
Data Bus Width 9b
Direction Bidirectional
Organization 8KX9
Density 144 kb
Parallel/Serial PARALLEL
Sync/Async Asynchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability Yes
FWFT Support No
Output Enable NO
Cycle Time 30 ns

Dimensions

Length 14mm
Width 6.1mm
Thickness 1mm

Compliance

RoHS Status RoHS Compliant
Lead Free Contains Lead

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