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Package TSSOP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description COMMERCIAL Asynchronous PARALLEL Lead Tin (Function) FIFO 0C 5.5V 72kb 30ns
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TSSOP
Number of Pins 56

Technical

Packaging Tape & Reel
Published 2012
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 56
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 2
Supply Voltage 5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 56
Operating Supply Voltage 5V
Power Supplies 5V
Temperature Grade COMMERCIAL
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 150mA
Max Supply Current 150mA
Clock Frequency 33MHz
Cycle Time 30 ns
Output Enable NO
FWFT Support No
Retransmit Capability Yes
Bus Directional Unidirectional
Memory IC Type OTHER FIFO
Word Size 9b
Sync/Async Asynchronous
Parallel/Serial PARALLEL
Density 72 kb
Organization 4KX9
Direction Bidirectional
Access Time 20 ns

Compliance

Lead Free Contains Lead
RoHS Status RoHS Compliant

Dimensions

Thickness 1mm
Width 6.1mm
Length 14mm

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