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Package DIP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description COMMERCIAL Asynchronous PARALLEL Lead Tin (Function) FIFO 0C 5.5V 1.1kB 65ns
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Radiation Hardening No

Dimensions

Thickness 3.3mm
Width 7.62mm
Length 34.3mm
Height Seated (Max) 4.572mm

Technical

Cycle Time 65 ns
Output Enable NO
Retransmit Capability Yes
Bus Directional Unidirectional
Memory IC Type OTHER FIFO
Word Size 9b
Sync/Async Asynchronous
Parallel/Serial PARALLEL
Standby Current-Max 0.0005A
Density 9 kb
Data Bus Width 9b
Access Time 50 ns
Frequency (Max) 15MHz
Max Supply Current 80mA
Nominal Supply Current 80mA
Element Configuration Dual
Memory Size 1.1kB
Min Supply Voltage 4.5V
Max Supply Voltage 5.5V
Number of Circuits 1
Temperature Grade COMMERCIAL
Power Supplies 5V
Operating Supply Voltage 5V
Pin Count 28
Terminal Pitch 2.54mm
Supply Voltage 5V
Number of Functions 1
Peak Reflow Temperature (Cel) 245
Technology CMOS
Subcategory FIFOs
Additional Feature RETRANSMIT
Min Operating Temperature 0°C
Max Operating Temperature 70°C
ECCN Code EAR99
Number of Terminations 28
Moisture Sensitivity Level (MSL) 1
Part Status Discontinued
Pbfree Code no
JESD-609 Code e0
Published 2009

Physical

Weight 4.190003g
Number of Pins 28
Package / Case DIP
Mount Through Hole
Contact Plating Lead, Tin

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