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RoHS
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Package DIP
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description INDUSTRIAL PARALLEL Tin 2009 (Function) FIFO -40C 5.5V 9216bit 25ns
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Technical Details

Compliance

Lead Free Lead Free
RoHS Status RoHS Compliant

Dimensions

Thickness 3.8mm
Width 15.24mm
Length 36.6mm
Height Seated (Max) 4.699mm

Technical

Cycle Time 25 ns
Output Enable NO
FWFT Support No
Retransmit Capability Yes
Bus Directional Unidirectional
Memory IC Type OTHER FIFO
Parallel/Serial PARALLEL
Memory Density 9216 bit
Standby Current-Max 0.005A
Organization 1KX9
Access Time 15 ns
Clock Frequency 40MHz
Max Supply Current 80mA
Element Configuration Dual
Min Supply Voltage 4.5V
Max Supply Voltage 5.5V
Temperature Grade INDUSTRIAL
Power Supplies 5V
Operating Supply Voltage 5V
Pin Count 28
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 2.54mm
Supply Voltage 5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Technology CMOS
Subcategory FIFOs
HTS Code 8542.32.00.71
Additional Feature RETRANSMIT
Min Operating Temperature -40°C
Max Operating Temperature 85°C
ECCN Code EAR99
Number of Terminations 28
Moisture Sensitivity Level (MSL) 1
Pbfree Code yes
JESD-609 Code e3
Published 2009

Physical

Number of Pins 28
Package / Case DIP
Mount Through Hole
Contact Plating Tin

Supply Chain

Factory Lead Time 10 Weeks

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