CYFB0072V33L-133BGXI
RoHS 
RoHS compliant
RoHS compliantPackage FBGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
FBGA e1 CMOS ALSO REQURIES 1.8V fifo memory 133MHz 600mA 1mm 10ns
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Technical Details
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case FBGA
Number of Pins 209
Technical
Published 2011
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 209
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature ALSO REQURIES 1.8 V
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 209
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Number of Circuits 2
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 9MB
Element Configuration Dual
Nominal Supply Current 600mA
Max Supply Current 600mA
Access Time 10 ns
Data Bus Width 36b
Memory Width 36
Density 72 Mb
Sync/Async Synchronous
Word Size 36b
Memory IC Type MEMORY CIRCUIT
Bus Directional Unidirectional
Retransmit Capability No
Dimensions
Height Seated (Max) 1.96mm
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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