CYF0018V33L-133BGXI
RoHS 
RoHS compliant
RoHS compliantPackage 209-BGA
Category Integrated Circuits (ICs) / Logic - FIFOs Memory
Description
Width Tray 8542.32.00.71 CMOS fifo memory 133MHz 0.6mA 1mm 7.5ns
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Technical Details
Supply Chain
Factory Lead Time 13 Weeks
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 209-BGA
Number of Pins 209
Technical
Operating Temperature -40°C~85°C
Packaging Tray
Published 2009
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 209
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Function Synchronous
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.8V
Supply Voltage-Min (Vsup) 1.425V
Memory Size 18M 512K x 36
Element Configuration Dual
Supply Current-Max 0.6mA
Access Time 10ns
Data Bus Width 36b
Direction Unidirectional
Organization 512KX36
Memory Width 36
Density 18 Mb
Max Frequency 133MHz
Parallel/Serial PARALLEL
Memory IC Type OTHER FIFO
Bus Directional Uni-Directional
FWFT Support No
Programmable Flags Support Yes
Output Enable YES
Expansion Type Width
Cycle Time 7.5 ns
Dimensions
Height Seated (Max) 1.96mm
Length 22mm
Compliance
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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