DS34S132GN
RoHS
/
Package 676-BGA
Category Integrated Circuits (ICs) / Interface - Telecom
Description
Non-RoHS Compliant BOTTOM BALL Obsolete Telecom IC TDM-over-Packet (TDMoP) -40C~85C 27mm 1.8V 3.3V
PDF
/
Buying Options
Total Price: USD $304.28
Unit Price: USD $304.2755
≥1 USD $304.2755
Inventory: 19
Minimum: 1
-
+
Technical Details
Physical
Mounting Type Surface Mount
Package / Case 676-BGA
Surface Mount YES
Technical
Operating Temperature -40°C~85°C
Packaging Tray
Published 2009
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 676
Voltage - Supply 1.8V 3.3V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.8V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number DS34S132
JESD-30 Code S-PBGA-B676
Function TDM-over-Packet (TDMoP)
Qualification Status Not Qualified
Interface TDMoP
Number of Circuits 1
Telecom IC Type FRAMER
Dimensions
Length 27mm
Width 27mm
Compliance
RoHS Status Non-RoHS Compliant
Recommended For You
DS34S132GN+price,DS34S132GN+datasheet,DS34S132GN+in stock,buy+DS34S132GN,finder+DS34S132GN,DS34S132GN+tutorials,DS34S132GN+download