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Package 316-BGA
Category Integrated Circuits (ICs) / Interface - Telecom
Description Non-RoHS Compliant Contains Lead BOTTOM BALL interface telecom -40C~85C 27mm 300mA 2.97V~3.63V
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant

Dimensions

Width 27mm
Length 27mm
Height Seated (Max) 2.53mm

Technical

Telecom IC Type FRAMER
Operating Supply Current 300mA
Interface Parallel/Serial
Qualification Status Not Qualified
JESD-30 Code S-PBGA-B316
Pin Count 316
Base Part Number DS3120
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Terminal Pitch 1.27mm
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 2.97V~3.63V
Technology CMOS
HTS Code 8542.39.00.01
Terminal Finish TIN LEAD
Number of Terminations 316
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
Pbfree Code no
JESD-609 Code e0
Published 2006
Packaging Tube
Operating Temperature -40°C~85°C

Physical

Package / Case 316-BGA
Mounting Type Surface Mount
Mount Surface Mount

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