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TWR-MCF5225X

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package /
Category Development Boards, Kits, Programmers / Evaluation Boards - Embedded - MCU, DSP
Description MCF5225X, OPEN-SOURCE BDM, USB 2.0, TOWER SYSTEM MODULE; Silicon Manufacturer:NXP; Core Architecture:ColdFire; Core Sub-Architecture:ColdFire v2; Silicon Core Number:MCF52; Silicon Family Name:MCF5225x; No. of Bits:32bit ;RoHS Compliant: Yes
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Technical Details

Physical

Mounting Type Fixed

Technical

Published 2008
Series ColdFire?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type MCU 32-Bit
Core Processor Coldfire V2
Utilized IC / Part MCF5225x
Contents Board(s), Cable(s)
Board Type Evaluation Platform
Platform Tower System

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

XR22417CV64EVB

XR22417CV64EVB

Exar Corporation

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