XCZU7EV-L2FBVB900E
RoHS 
RoHS compliant
RoHS compliantPackage 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz 0.72V
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Buying Options
Total Price: USD $930.73
Unit Price: USD $930.72545
≥1 USD $930.72545
Inventory: 201
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC EV
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Compliance
RoHS Status ROHS3 Compliant
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