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XCZU7CG-L2FFVC1156E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 1156-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1156FCBGA
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Technical

Primary Attributes Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
RAM Size 256KB
Speed 533MHz, 1.3GHz
Number of I/O 360
Supply Voltage-Min (Vsup) 0.698V
Supply Voltage-Max (Vsup) 0.742V
JESD-30 Code R-PBGA-B1156
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage 0.72V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.31.00.01
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Series Zynq? UltraScale+? MPSoC CG
Published 2016
Packaging Tray
Operating Temperature 0°C~100°C TJ

Physical

Surface Mount YES
Package / Case 1156-BBGA, FCBGA

Supply Chain

Factory Lead Time 11 Weeks

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