XCZU6CG-2FFVC900I
RoHS 
RoHS compliant
RoHS compliantPackage 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 1.3GHz 0.85V
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Buying Options
Total Price: USD $304.28
Unit Price: USD $304.2755
≥1 USD $304.2755
Inventory: 510
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 204
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 469K+ Logic Cells
Compliance
RoHS Status ROHS3 Compliant
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