XCZU4EV-L2FBVB900E
RoHS 
RoHS compliant
RoHS compliantPackage 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz 0.72V
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Technical
Primary Attributes Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
RAM Size 256KB
Speed 533MHz, 600MHz, 1.3GHz
Number of I/O 204
Supply Voltage-Min (Vsup) 0.698V
Supply Voltage-Max (Vsup) 0.742V
JESD-30 Code R-PBGA-B900
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage 0.72V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.31.00.01
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Number of Terminations 900
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Series Zynq? UltraScale+? MPSoC EV
Published 2016
Packaging Tray
Operating Temperature 0°C~100°C TJ
Physical
Surface Mount YES
Package / Case 900-BBGA, FCBGA
Supply Chain
Factory Lead Time 11 Weeks
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