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XCZU4EV-L1FBVB900I

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA
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Technical Details

Technical

JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage 0.72V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.31.00.01
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Number of Terminations 900
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Series Zynq? UltraScale+? MPSoC EV
Published 2016
Packaging Tray
Operating Temperature -40°C~100°C TJ

Compliance

RoHS Status ROHS3 Compliant

Physical

Surface Mount YES
Package / Case 900-BBGA, FCBGA

Supply Chain

Factory Lead Time 11 Weeks

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