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XCZU4EG-2FBVB900E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA
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Technical Details

Supply Chain

Factory Lead Time 11 Weeks

Physical

Package / Case 900-BBGA, FCBGA

Technical

Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 192K+ Logic Cells

Compliance

RoHS Status ROHS3 Compliant

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