XCZU3EG-3SFVC784E
RoHS
/
Package 784-BFBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A53 784FCBGA
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Technical Details
Physical
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC EG
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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