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XCZU2EG-2SFVA625E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 625-BFBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 625FCBGA
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Technical Details

Supply Chain

Factory Lead Time 11 Weeks

Physical

Package / Case 625-BFBGA, FCBGA

Technical

Operating Temperature 0?°C~100?°C TJ
Packaging Tray
Published 2013
Series Zynq?? UltraScale+a?? MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 180
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM?? Cortex??-A53 MPCorea?? with CoreSighta??, Dual ARM??Cortexa??-R5 with CoreSighta??, ARM Malia??-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq??UltraScale+a?? FPGA, 103K+ Logic Cells

Compliance

RoHS Status ROHS3 Compliant

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