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XCZU2CG-2SFVA625E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 625-BFBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 625FCBGA
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Technical

Primary Attributes Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
RAM Size 256KB
Speed 533MHz, 1.3GHz
Number of I/O 180
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
HTS Code 8542.31.00.01
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Series Zynq? UltraScale+? MPSoC CG
Published 2016
Packaging Tray
Operating Temperature 0°C~100°C TJ

Physical

Package / Case 625-BFBGA, FCBGA

Supply Chain

Factory Lead Time 11 Weeks

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